PLEASE NOTE:
'REGISTERED ECC' / 'REGISTERED NON-ECC' (SERVER MEMORY) ARE NOT SUITABLE FOR USE IN CONSUMER PC / NOTEBOOK
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Disclaimer: Product photos and specifications are provided by Universal Databases and are often based on new products. Photos are indicative, SpareIT tries to show this as accurately as possible.
Please pay close attention to the product description and contact us if you have any questions.
Description
HP Intel Xeon 3.8GHz. Processor family: Intel® Xeon®, Processor socket: Socket 604 (mPGA604), Processor lithography: 90 nm. Market segment: Server, Number of Processing Die Transistors: 169 M, Processing Die size: 135 mm². Processor package size: 42.5 mm
Maximize Performance. Minimize Power. Automatically.
As data centers reach the upper limits of their power and cooling capacity, efficiency has become the focus of extending the life of existing data centers and designing new ones. As part of these efforts, IT needs to refresh existing infrastructure with standard enterprise servers that deliver more performance and scalability, more efficiently.
Specifications
Weight & dimensions | |
---|---|
Processor package size | 42.5 mm |
Operational conditions | |
Tcase | 73 °C |
Features | |
Market segment | Server |
Processing Die size | 135 mm² |
Number of Processing Die Transistors | 169 M |
Power | |
VID Voltage Range | 1.2875 - 1.3875 V |
Thermal Design Power (TDP) | 110 W |
Graphics | |
On-board graphics adapter | No |
Processor | |
Processor cache type | L2 |
Processor cache | 2 MB |
Processor operating modes | 64-bit |
Processor front side bus | 800 MHz |
Processor lithography | 90 nm |
Component for | Server/workstation |
Processor socket | Socket 604 (mPGA604) |
Processor cores | 1 |
Processor base frequency | 3.8 GHz |
Processor family | Intel® Xeon® |